A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Polymer Competence Center Leoben GmbH
- Institute of Mechanics
- CD-Laboratory for Fatigue Analysis
- AT and S AG
Details
| Original language | English |
|---|---|
| Title of host publication | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 |
| Publisher | Institute of Electrical and Electronics Engineers |
| ISBN (electronic) | 9798350393637 |
| DOIs | |
| Publication status | Published - 2024 |
| Event | 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 - Catania, Italy Duration: 7 Apr 2024 → 10 Apr 2024 |
Publication series
| Name | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 |
|---|
Conference
| Conference | 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 |
|---|---|
| Country/Territory | Italy |
| City | Catania |
| Period | 7/04/24 → 10/04/24 |
