Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Polymer Competence Center Leoben GmbH
- Chair of Energy Conversion
- Tu Dortmund University
Details
Original language | English |
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Title of host publication | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 |
Publisher | Institute of Electrical and Electronics Engineers |
ISBN (electronic) | 9798350345971 |
DOIs | |
Publication status | Published - 2023 |
Event | 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Austria Duration: 16 Apr 2023 → 19 Apr 2023 |
Publication series
Name | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 |
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Conference
Conference | 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 |
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Country/Territory | Austria |
City | Graz |
Period | 16/04/23 → 19/04/23 |