Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Authors

  • A. Thalhamer
  • S. Hasil
  • K. Hrbinic
  • V. Feigl
  • M. Pfost

External Organisational units

  • Polymer Competence Center Leoben GmbH
  • Chair of Energy Conversion
  • Tu Dortmund University

Details

Original languageEnglish
Title of host publication2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
PublisherInstitute of Electrical and Electronics Engineers
ISBN (electronic)9798350345971
DOIs
Publication statusPublished - 2023
Event24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Austria
Duration: 16 Apr 202319 Apr 2023

Publication series

Name2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Conference

Conference24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Country/TerritoryAustria
CityGraz
Period16/04/2319/04/23