Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Polymer Competence Center Leoben GmbH
- Austria Technologie Systemtechnik Aktiengesellschaft
- Austria-Mikro-Syst.-Intl. GmbH
Details
| Original language | English |
|---|---|
| Title of host publication | 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020 |
| Publisher | Institute of Electrical and Electronics Engineers |
| Pages | 380-385 |
| Number of pages | 6 |
| ISBN (electronic) | 9781728189116 |
| DOIs | |
| Publication status | Published - 2 Dec 2020 |
| Event | 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 - Virtual, Singapore, Singapore Duration: 2 Dec 2020 → 4 Dec 2020 |
Publication series
| Name | 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020 |
|---|
Conference
| Conference | 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 |
|---|---|
| Country/Territory | Singapore |
| City | Virtual, Singapore |
| Period | 2/12/20 → 4/12/20 |
