Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Standard

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. / Yalagach, Mahesh; Fuchs, Peter Filipp; Antretter, Thomas et al.
2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, 2020. p. 380-385 9315091 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Harvard

Yalagach, M, Fuchs, PF, Antretter, T, Qi, T & Weber, M 2020, Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. in 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020., 9315091, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020, Institute of Electrical and Electronics Engineers, pp. 380-385, 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020, Virtual, Singapore, Singapore, 2/12/20. https://doi.org/10.1109/EPTC50525.2020.9315091

APA

Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T., & Weber, M. (2020). Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. In 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020 (pp. 380-385). Article 9315091 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EPTC50525.2020.9315091

Vancouver

Yalagach M, Fuchs PF, Antretter T, Qi T, Weber M. Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. In 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers. 2020. p. 380-385. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020). doi: 10.1109/EPTC50525.2020.9315091

Author

Yalagach, Mahesh ; Fuchs, Peter Filipp ; Antretter, Thomas et al. / Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, 2020. pp. 380-385 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Bibtex - Download

@inproceedings{ffdd320cd7ba489fa2c0d183e30d564e,
title = "Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions",
keywords = "advanced hygro-thermo-mechanical simulation, die deformation, four-point bending, Moisture diffusion, pressure sensor",
author = "Mahesh Yalagach and Fuchs, {Peter Filipp} and Thomas Antretter and Tao Qi and Markus Weber",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 ; Conference date: 02-12-2020 Through 04-12-2020",
year = "2020",
month = dec,
day = "2",
doi = "10.1109/EPTC50525.2020.9315091",
language = "English",
series = "2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020",
publisher = "Institute of Electrical and Electronics Engineers",
pages = "380--385",
booktitle = "2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

AU - Yalagach, Mahesh

AU - Fuchs, Peter Filipp

AU - Antretter, Thomas

AU - Qi, Tao

AU - Weber, Markus

N1 - Publisher Copyright: © 2020 IEEE.

PY - 2020/12/2

Y1 - 2020/12/2

KW - advanced hygro-thermo-mechanical simulation

KW - die deformation

KW - four-point bending

KW - Moisture diffusion

KW - pressure sensor

UR - http://www.scopus.com/inward/record.url?scp=85100200141&partnerID=8YFLogxK

U2 - 10.1109/EPTC50525.2020.9315091

DO - 10.1109/EPTC50525.2020.9315091

M3 - Conference contribution

AN - SCOPUS:85100200141

T3 - 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020

SP - 380

EP - 385

BT - 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020

PB - Institute of Electrical and Electronics Engineers

T2 - 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020

Y2 - 2 December 2020 through 4 December 2020

ER -

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