Peter Fuchs
(Former)
1 - 10 out of 17Page size: 10
Research output
- 2023
- Published
Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2022
- Published
A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2021
- Published
Mechanical behavior of 3D-printed polymeric metamaterials for lightweight applications
Truszkiewicz, E., Thalhamer, A., Rossegger, M., Vetter, M., Meier, G., Rossegger, E., Fuchs, P., Schlögl, S. & Berer, M., 1 Nov 2021, In: Journal of applied polymer science. 139, 6, 51618.Research output: Contribution to journal › Article › Research › peer-review
- Published
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Quantifying matrix-fiber mechanical interactions in hyperelastic materials
Mansouri, M. R., Beter, J., Fuchs, P. F., Schrittesser, B. & Pinter, G., 5 Jan 2021, In: International Journal of Mechanical Sciences. 195.2021, 1 April, 14 p., 106268.Research output: Contribution to journal › Article › Research › peer-review
- Published
Process simulation for digital light processing (DLP) based 3D printing
Thalhammer, A., Strohmeier, L., Pishvazadeh Moghaddam, H., Wolfberger, A. & Fuchs, P., 2021.Research output: Contribution to conference › Poster › Research
- 2020
- Published
Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions
Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
The Tension-Twist Coupling Mechanism in Flexible Composites: A Systematic Study Based on Tailored Laminate Structures Using a Novel Test Device
Beter, J., Schrittesser, B., Meier, G., Lechner, B., Mansouri, M., Fuchs, P. F. & Pinter, G., 24 Nov 2020, In: Polymers. 12.2020, 12, p. 1-16 16 p., 2780.Research output: Contribution to journal › Article › Research › peer-review
