Peter Fuchs
(Former)
1 - 10 out of 19Page size: 10
Research output
- 2024
- Published
A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies
Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics
Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2023
- Published
Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2022
- Published
A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2021
- Published
Mechanical behavior of 3D-printed polymeric metamaterials for lightweight applications
Truszkiewicz, E., Thalhamer, A., Rossegger, M., Vetter, M., Meier, G., Rossegger, E., Fuchs, P., Schlögl, S. & Berer, M., 1 Nov 2021, In: Journal of applied polymer science. 139, 6, 51618.Research output: Contribution to journal › Article › Research › peer-review
- Published
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Quantifying matrix-fiber mechanical interactions in hyperelastic materials
Mansouri, M. R., Beter, J., Fuchs, P. F., Schrittesser, B. & Pinter, G., 5 Jan 2021, In: International Journal of Mechanical Sciences. 195.2021, 1 April, 14 p., 106268.Research output: Contribution to journal › Article › Research › peer-review
- Published
Process simulation for digital light processing (DLP) based 3D printing
Thalhammer, A., Strohmeier, L., Pishvazadeh Moghaddam, H., Wolfberger, A. & Fuchs, P., 2021.Research output: Contribution to conference › Poster › Research
