Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Polymer Competence Center Leoben GmbH
- Austria-Mikro-Syst.-Intl. GmbH
- Austria Technologie Systemtechnik Aktiengesellschaft
Details
| Original language | English |
|---|---|
| Title of host publication | 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers |
| ISBN (electronic) | 9781538668139 |
| DOIs | |
| Publication status | Published - 26 Nov 2018 |
| Event | 7th Electronic System-Integration Technology Conference, ESTC 2018 - Dresden, Germany Duration: 18 Sept 2018 → 21 Sept 2018 |
Conference
| Conference | 7th Electronic System-Integration Technology Conference, ESTC 2018 |
|---|---|
| Country/Territory | Germany |
| City | Dresden |
| Period | 18/09/18 → 21/09/18 |
