Klaus Fellner
(Former)
1 - 10 out of 11Page size: 10
Research output
- Published
ROBUST OPTICAL 2D PERMEABILITY CHARACTERIZATION OF REINFORCING FABRICS
Fauster, E., Grössing, H., Fellner, K. & Schledjewski, R., 26 Jun 2016, Proceedings of the 17th European Conference on Composite Materials (ECCM17).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads
Fellner, K., Fuchs, P. & Pinter, G., 2014, 13th Youth Symposium on Experimental Solid Mechanics. p. 29-32Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Method development for the cyclic characterization of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Pinter, G., Antretter, T. & Krivec, T., 2014, In: Circuit World. 40, p. 53-60Research output: Contribution to journal › Article › Research › peer-review
- Published
Determination of cyclic mechanical properties of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation des "Single Via Thermal Cycle Test" - Modellerstellung und Bestimmung der Materialeingangsparameter
Fellner, K., 2012Research output: Thesis › Master's Thesis
- Published
Degradation of the electrical performance of Printed Circuit Boards (PCBs) after cyclic thermo-mechanical loading
Fellner, K., 2015Research output: Thesis › Doctoral Thesis
- Published
Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads
Fellner, K., Antretter, T., Fuchs, P. F. & Tao, Q., 2016, In: Microelectronics Reliability. p. 148-155Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Cyclic mechanical behavior of thin layers of copper: A theoretical and numerical study
Fellner, K., Antretter, T., Fuchs, P. & Pelisset, T. M. A., 8 Dec 2015, (E-pub ahead of print) In: The Journal of Strain Analysis for Engineering Design. 51.2016, 2, p. 1-9 9 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Local damage simulations of printed circuit boards based on determined in plane cohesive zone parameters
Fuchs, P. F., Pinter, G. & Fellner, K., 2013, In: Circuit World. 39, p. 60-66Research output: Contribution to journal › Article › Research › peer-review
- Published
Simulation von Delamination in Mehrschichtverbunden
Fuchs, P., Stelzer, S., Fellner, K., Pothukuchi, H. K. R. & Pinter, G., 5 Mar 2015.Research output: Contribution to conference › Presentation › Research
