Thin solid films, ‎0040-6090

Journal

ISSNs0040-6090
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Research output

  1. Published

    A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films

    Matoy, K., Schönherr, H., Detzel, T., Schöberl, T., Pippan, R., Motz, C. & Dehm, G., 2009, In: Thin solid films. 518, p. 247-256

    Research output: Contribution to journal › Article › Research › peer-review

  2. Published

    Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

    Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.

    Research output: Contribution to journal › Article › Research › peer-review

  3. Published

    Can micro-compression testing provide stress-strain data for thin films? A comparative study using Cu, VN, TiN and W coatings

    Dehm, G., Wörgötter, H.-P., Cazottes, S., Purswani, J. M., Gall, D., Mitterer, C. & Kiener, D., 2009, In: Thin solid films. 518, p. 1517-1521

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Characterization of Tribo-Layers on Self-Lubricating PACVD TiN Coatings

    Badisch, E., Mitterer, C., Mayerhofer, P. H., Mori, G., Bakker, R., Brenner, J. & Störi, H., 2004, In: Thin solid films. 460, p. 125-132

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    Compositional and structural evolution of sputtered Ti-Al-N

    Chen, L., Moser, M., Du, Y. & Mayrhofer, P. H., 2009, In: Thin solid films. p. 6635-6641

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    Copper diffusion into single-crystalline TiN studied by transmission electron microscopy and atom probe tomography

    Mühlbacher, M., Mendez Martin, F., Sartory, B., Schalk, N., Keckes, J., Lu, J., Hultman, L. & Mitterer, C., 2015, In: Thin solid films. 574, p. 103-109

    Research output: Contribution to journal › Article › Research › peer-review

  7. Published

    Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending

    Kreiml, P., Rausch, M., Terziyska, V. L., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 1 Oct 2019, In: Thin solid films. 687.2019, 1 October, 9 p., 137480.

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    Crack arrest in thin metallic film stacks due to material- and residual stress inhomogeneities

    Kozic, D., Gänser, H.-P., Brunner, R., Kiener, D., Antretter, T. & Kolednik, O., 31 Dec 2018, In: Thin solid films. p. 14-22 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

    Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330

    Research output: Contribution to journal › Article › Research › peer-review

  10. Published

    Cross-sectional X-ray nanobeam diffraction analysis of a compositionally graded CrNx thin film

    Bartosik, M., Daniel, R., Mitterer, C., Matko, I., Burghammer, M., Mayrhofer, P. H. & Keckes, J., 2013, In: Thin solid films. 542, p. 1-4

    Research output: Contribution to journal › Article › Research › peer-review

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