Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

Research output: Contribution to journalArticleResearchpeer-review

Organisational units

External Organisational units

  • Erich Schmid Institute of Materials Science

Details

Original languageEnglish
Pages (from-to)153-164
Number of pages12
JournalThin solid films
Volume612.2016
Issue number1 August
DOIs
Publication statusPublished - 1 Aug 2016