Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- Erich Schmid Institute of Materials Science
Details
Original language | English |
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Pages (from-to) | 153-164 |
Number of pages | 12 |
Journal | Thin solid films |
Volume | 612.2016 |
Issue number | 1 August |
DOIs | |
Publication status | Published - 1 Aug 2016 |