Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

Research output: Contribution to journal › Article › Research › peer-review

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Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations. / Bigl, Stephan; Wurster, Stefan; Cordill, Megan et al.
In: Thin solid films, Vol. 612.2016, No. 1 August, 01.08.2016, p. 153-164.

Research output: Contribution to journal › Article › Research › peer-review

Harvard

Bigl, S, Wurster, S, Cordill, M & Kiener, D 2016, 'Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations', Thin solid films, vol. 612.2016, no. 1 August, pp. 153-164. https://doi.org/10.1016/j.tsf.2016.05.044

APA

Bigl, S., Wurster, S., Cordill, M., & Kiener, D. (2016). Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations. Thin solid films, 612.2016(1 August), 153-164. https://doi.org/10.1016/j.tsf.2016.05.044

Vancouver

Bigl S, Wurster S, Cordill M, Kiener D. Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations. Thin solid films. 2016 Aug 1;612.2016(1 August):153-164. doi: 10.1016/j.tsf.2016.05.044

Author

Bigl, Stephan ; Wurster, Stefan ; Cordill, Megan et al. / Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations. In: Thin solid films. 2016 ; Vol. 612.2016, No. 1 August. pp. 153-164.

Bibtex - Download

@article{9fbfe916ef7a46dbbce906469601b439,
title = "Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations",
keywords = "Copper metallization, Inorganic impurities, Small angle grain boundary formation, Surface roughening, Thermo-mechanical fatigue, Twin boundary migration, Void formation",
author = "Stephan Bigl and Stefan Wurster and Megan Cordill and Daniel Kiener",
year = "2016",
month = aug,
day = "1",
doi = "10.1016/j.tsf.2016.05.044",
language = "English",
volume = "612.2016",
pages = "153--164",
journal = "Thin solid films",
issn = "0040-6090",
publisher = "Elsevier",
number = "1 August",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

AU - Bigl, Stephan

AU - Wurster, Stefan

AU - Cordill, Megan

AU - Kiener, Daniel

PY - 2016/8/1

Y1 - 2016/8/1

KW - Copper metallization

KW - Inorganic impurities

KW - Small angle grain boundary formation

KW - Surface roughening

KW - Thermo-mechanical fatigue

KW - Twin boundary migration

KW - Void formation

UR - http://www.scopus.com/inward/record.url?scp=84973911421&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2016.05.044

DO - 10.1016/j.tsf.2016.05.044

M3 - Article

AN - SCOPUS:84973911421

VL - 612.2016

SP - 153

EP - 164

JO - Thin solid films

JF - Thin solid films

SN - 0040-6090

IS - 1 August

ER -

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