Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
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in: Thin solid films, Jahrgang 612.2016, Nr. 1 August, 01.08.2016, S. 153-164.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
AU - Bigl, Stephan
AU - Wurster, Stefan
AU - Cordill, Megan
AU - Kiener, Daniel
PY - 2016/8/1
Y1 - 2016/8/1
KW - Copper metallization
KW - Inorganic impurities
KW - Small angle grain boundary formation
KW - Surface roughening
KW - Thermo-mechanical fatigue
KW - Twin boundary migration
KW - Void formation
UR - http://www.scopus.com/inward/record.url?scp=84973911421&partnerID=8YFLogxK
U2 - 10.1016/j.tsf.2016.05.044
DO - 10.1016/j.tsf.2016.05.044
M3 - Article
AN - SCOPUS:84973911421
VL - 612.2016
SP - 153
EP - 164
JO - Thin solid films
JF - Thin solid films
SN - 0040-6090
IS - 1 August
ER -
