Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers
Publikationen: Konferenzbeitrag › Vortrag › Forschung
Autoren
Organisationseinheiten
Details
| Originalsprache | Englisch |
|---|---|
| Status | Veröffentlicht - 2016 |
| Veranstaltung | 8th International Conference On Technological Advances Of Thin Films and Surface Coatings - Singapur, Singapur Dauer: 12 Juli 2016 → 15 Juli 2016 |
Konferenz
| Konferenz | 8th International Conference On Technological Advances Of Thin Films and Surface Coatings |
|---|---|
| Kurztitel | ThinFilms2016 |
| Land/Gebiet | Singapur |
| Ort | Singapur |
| Zeitraum | 12/07/16 → 15/07/16 |
