Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers
Research output: Contribution to conference › Presentation › Research
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Details
| Original language | English |
|---|---|
| Publication status | Published - 2016 |
| Event | 8th International Conference On Technological Advances Of Thin Films and Surface Coatings - Singapur, Singapore Duration: 12 Jul 2016 → 15 Jul 2016 |
Conference
| Conference | 8th International Conference On Technological Advances Of Thin Films and Surface Coatings |
|---|---|
| Abbreviated title | ThinFilms2016 |
| Country/Territory | Singapore |
| City | Singapur |
| Period | 12/07/16 → 15/07/16 |
