Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers

Research output: Contribution to journalArticleResearchpeer-review

External Organisational units

  • Infineon Technologies Germany AG, Regensburg
  • Kompetenzzentrum Automobil-und Industrie-Elektronik GmbH

Details

Original languageEnglish
Article number022201
Number of pages11
JournalJournal of vacuum science & technology / B (JVST)
Volume35.2017
Issue number2
DOIs
Publication statusPublished - 9 Feb 2017