Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
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In: Journal of vacuum science & technology / B (JVST), Vol. 35.2017, No. 2, 022201, 09.02.2017.
Research output: Contribution to journal › Article › Research › peer-review
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TY - JOUR
T1 - Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
AU - Souli, Imane
AU - Terziyska, Velislava
AU - Keckes, Jozef
AU - Robl, Werner
AU - Zechner, Johannes
AU - Mitterer, Christian
PY - 2017/2/9
Y1 - 2017/2/9
U2 - 10.1116/1.4975805
DO - 10.1116/1.4975805
M3 - Article
VL - 35.2017
JO - Journal of vacuum science & technology / B (JVST)
JF - Journal of vacuum science & technology / B (JVST)
SN - 1071-1023
IS - 2
M1 - 022201
ER -