Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers
Research output: Contribution to conference › Presentation › Research
Standard
Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . / Souli, Imane; Terziyska, Velislava; Keckes, Jozef et al.
2016. 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore.
2016. 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore.
Research output: Contribution to conference › Presentation › Research
Harvard
Souli, I, Terziyska, V, Keckes, J, Zechner, J & Mitterer, C 2016, 'Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers ', 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore, 12/07/16 - 15/07/16.
APA
Souli, I., Terziyska, V., Keckes, J., Zechner, J., & Mitterer, C. (2016). Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore.
Vancouver
Souli I, Terziyska V, Keckes J, Zechner J, Mitterer C. Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . 2016. 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore.
Author
Bibtex - Download
@conference{e4d57ba6f325420e96a05ad406fd8a86,
title = "Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers ",
author = "Imane Souli and Velislava Terziyska and Jozef Keckes and Josef Zechner and Christian Mitterer",
year = "2016",
language = "English",
note = "8th International Conference On Technological Advances Of Thin Films and Surface Coatings ; Conference date: 12-07-2016 Through 15-07-2016",
}
RIS (suitable for import to EndNote) - Download
TY - CONF
T1 - Design of multilayer metallization to reduce mechanical loading
T2 - 8th International Conference On Technological Advances Of Thin Films and Surface Coatings
AU - Souli, Imane
AU - Terziyska, Velislava
AU - Keckes, Jozef
AU - Zechner, Josef
AU - Mitterer, Christian
PY - 2016
Y1 - 2016
M3 - Presentation
Y2 - 12 July 2016 through 15 July 2016
ER -
