Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

Publikationen: KonferenzbeitragVortragForschung

Standard

Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . / Souli, Imane; Terziyska, Velislava; Keckes, Jozef et al.
2016. 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapur.

Publikationen: KonferenzbeitragVortragForschung

Bibtex - Download

@conference{e4d57ba6f325420e96a05ad406fd8a86,
title = "Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers ",
author = "Imane Souli and Velislava Terziyska and Jozef Keckes and Josef Zechner and Christian Mitterer",
year = "2016",
language = "English",
note = "8th International Conference On Technological Advances Of Thin Films and Surface Coatings ; Conference date: 12-07-2016 Through 15-07-2016",

}

RIS (suitable for import to EndNote) - Download

TY - CONF

T1 - Design of multilayer metallization to reduce mechanical loading

T2 - 8th International Conference On Technological Advances Of Thin Films and Surface Coatings

AU - Souli, Imane

AU - Terziyska, Velislava

AU - Keckes, Jozef

AU - Zechner, Josef

AU - Mitterer, Christian

PY - 2016

Y1 - 2016

M3 - Presentation

Y2 - 12 July 2016 through 15 July 2016

ER -