Institute of Electrical and Electronics Engineers

Publisher

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Research output

  1. 2019
  2. Published

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Simultaneous approximation of measurement values and derivative data using discrete orthogonal polynomials

    Ritt, R., Harker, M. & O'Leary, P., 1 May 2019, Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019. Institute of Electrical and Electronics Engineers, p. 282-289 8 p. 8780356. (Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. Published

    Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

    Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  5. Published

    Modeling of electrical networks in the cellular approach with regard to influencing variables on active and reactive power accuracy at different voltage levels

    Traupmann, A. & Kienberger, T., 2019

    Research output: Non-textual form › Web publication/site › Research

  6. 2018
  7. Published

    Influence of environmental factors like temperature and humidity on MEMS packaging materials.

    Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Numerical Investigation of Collective Motion of Cathode Spots

    Kharicha, A., Karimi-Sibaki, E., Ludwig, A. & Wu, M., 15 Nov 2018, 28th International Symposium on Discharges and Electrical Insulation in Vacuum: ISDEIV. Institute of Electrical and Electronics Engineers, Vol. 2. p. 467-469 3 p. (International Symposium on Discharges and Elevtrical Insultaion in Vacuum, ISDEIV).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    Force and acoustic emission measurements for condition monitoring of fine blanking tools

    Kollment, W., O'Leary, P., Harker, M., Klunsner, T. & Eck, S., 10 Jul 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  10. Published

    Real-time tensor polynomial approximation of crosshatch measured geometric surface data

    Harker, M., O'Leary, P., Plessing, L., Hergan, P. & Fauster, E., 10 Jul 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  11. Published

    Global least squares for time-domain system identification of state-space models

    Harker, M. & Rath, G., 6 Jul 2018, 2018 7th Mediterranean Conference on Embedded Computing, MECO 2018 - Including ECYPS 2018, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  12. Published

    Simulation of stiff systems on real-time hardware

    Zaev, E., Babunski, D., Tuneski, A. & Rath, G., 6 Jul 2018, 2018 7th Mediterranean Conference on Embedded Computing, MECO 2018 - Including ECYPS 2018, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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