Learning to Drive with Deep Reinforcement Learning

Chukamphaeng, N., Pasupa, K., Antenreiter, M. & Auer, P., 21 Jan 2021, KST 2021 - 2021 13th International Conference Knowledge and Smart Technology. Institute of Electrical and Electronics Engineers, p. 147-152 6 p. 9415770. (KST 2021 - 2021 13th International Conference Knowledge and Smart Technology).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Measurement of WBG-based power supplies

Zhu, H., Jafari, A., MacHtinger, K., Makoschitz, M. & Matioli, E., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

MEMS Based Inclinometers: Noise Characteristics and Suitable Signal Processing: Noise characteristics and suitable signal processing

Schmidt, R., O'Leary, P., Ritt, R. & Harker, M., 5 Jul 2017, I2MTC 2017 - 2017 IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 7969830

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Modelling Periodic Measurement Data Having a Piecewise Polynomial Trend Using the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., Oct 2023, IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Multi-physics simulation of the component attachment within embedding process

Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical Investigation of Collective Motion of Cathode Spots

Kharicha, A., Karimi-Sibaki, E., Ludwig, A. & Wu, M., 15 Nov 2018, 28th International Symposium on Discharges and Electrical Insulation in Vacuum: ISDEIV. Institute of Electrical and Electronics Engineers, Vol. 2. p. 467-469 3 p. (International Symposium on Discharges and Elevtrical Insultaion in Vacuum, ISDEIV).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Oscillation Damping With Input Shaping in Individual Metering Hydraulic Systems

Rath, G., Zaev, E. & Babunski, D., 1 Jun 2019, 2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings. Stojanovic, R., Jozwiak, L., Lutovac, B. & Jurisic, D. (eds.). Institute of Electrical and Electronics Engineers, 8760056. (2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution