Institute of Electrical and Electronics Engineers

Publisher

31 - 40 out of 76Page size: 10

Research output

  1. 2018
  2. Published

    Numerical Investigation of Collective Motion of Cathode Spots

    Kharicha, A., Karimi-Sibaki, E., Ludwig, A. & Wu, M., 15 Nov 2018, 28th International Symposium on Discharges and Electrical Insulation in Vacuum: ISDEIV. Institute of Electrical and Electronics Engineers, Vol. 2. p. 467-469 3 p. (International Symposium on Discharges and Elevtrical Insultaion in Vacuum, ISDEIV).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Influence of environmental factors like temperature and humidity on MEMS packaging materials.

    Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. 2019
  5. Published

    Modeling of electrical networks in the cellular approach with regard to influencing variables on active and reactive power accuracy at different voltage levels

    Traupmann, A. & Kienberger, T., 2019

    Research output: Non-textual form › Web publication/site › Research

  6. Published

    Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

    Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Simultaneous approximation of measurement values and derivative data using discrete orthogonal polynomials

    Ritt, R., Harker, M. & O'Leary, P., 1 May 2019, Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019. Institute of Electrical and Electronics Engineers, p. 282-289 8 p. 8780356. (Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    Oscillation Damping With Input Shaping in Individual Metering Hydraulic Systems

    Rath, G., Zaev, E. & Babunski, D., 1 Jun 2019, 2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings. Stojanovic, R., Jozwiak, L., Lutovac, B. & Jurisic, D. (eds.). Institute of Electrical and Electronics Engineers, 8760056. (2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  10. 2020

  11. Output Impedance Compensation of a Cascaded Advanced AC-Simulator

    Jonke, P., Makoschitz, M., Biswas, S., Stockl, J. & Ertl, H., Jun 2020, 2020 IEEE 29th International Symposium on Industrial Electronics, ISIE 2020 - Proceedings. Institute of Electrical and Electronics Engineers, p. 761-766 6 p. 9152397. (IEEE International Symposium on Industrial Electronics; vol. 2020-June).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  12. Published

    Unified Software Interface for Numerical Evaluation of Integrals and Derivatives of Fractional Order

    Skovranek, T., Harker, M., Podlubny, I., O'Leary, P. & Petras, I., 27 Oct 2020, Proceedings of the 2020 21st International Carpathian Control Conference, ICCC 2020. Petras, I. & Kacur, J. (eds.). Institute of Electrical and Electronics Engineers, 9257225. (Proceedings of the 2020 21st International Carpathian Control Conference, ICCC 2020).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  13. Analysis and Verification of a Cascaded Advanced AC-Simulator with Non-Linear Loads

    Jonke, P., Makoschitz, M., Biswas, S., Stockl, J. & Ertl, H., 9 Nov 2020, 2020 IEEE 21st Workshop on Control and Modeling for Power Electronics, COMPEL 2020. Institute of Electrical and Electronics Engineers, 9265769. (2020 IEEE 21st Workshop on Control and Modeling for Power Electronics, COMPEL 2020).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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