Research output

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  1. E-pub ahead of print

    Review of in-process defect monitoring for automated tape laying

    Yadav, N. & Schledjewski, R., 20 Jul 2023, (E-pub ahead of print) In: Composites Part A: Applied Science and Manufacturing. 173.2023, Oktober, 16 p., 107654.

    Research output: Contribution to journal › Article › Research › peer-review

  2. Published

    Parametric effect on inline width control for thermoplastic automated tape layup

    Yadav, N. & Schledjewski, R., Aug 2023.

    Research output: Contribution to conference › Paper

  3. Published

    Inline monitoring and control for Automated Tape Laying

    Yadav, N., 2023

    Research output: Thesis › Doctoral Thesis

  4. E-pub ahead of print

    In-line and off-line NDT defect monitoring for thermoplastic automated tape layup

    Yadav, N., Oswald-Tranta, B., Gürocak, M., Galic, A., Adam, R. & Schledjewski, R., 31 Mar 2023, (E-pub ahead of print) In: NDT and E international. 137.2023, July, 8 p., 102839.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    INLINE PROCESS MONITORING AND FAILURE MANAGEMENT CONCEPT FOR ATL

    Yadav, N., Schledjewski, R. & Fauster, E., 2024, Proceedings of the 21st European Conference on Composite Materials: Volume 5 - Manufacturing. p. 497-502 6 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. Published

    Reservoir Characterisation using Tracers: Analytical versus Numerical Methods

    Yahyaoui, G., 2017

    Research output: Thesis › Master's Thesis

  7. Published

    General Assessment of Industry 4.0 Awareness in South India —A Precondition for Efficient Organization Models?

    Yaibuathet Tippayawong, K., Safar, L., Sopko, J., Dancakova, D. & Woschank, M., 1 Jun 2021, Industry 4.0 for SMEs: Concepts, Examples and Applications. Matt, D., Modrak, V. & Zsifkovits, H. (eds.). Cham: Palgrave Macmillan Ltd., p. 345-391

    Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research

  8. Published

    Influence of environmental factors like temperature and humidity on MEMS packaging materials.

    Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  10. Published

    Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

    Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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