Research output

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  1. 2015
  2. Published

    Simulation des thermomechanischen Verhaltens von Grobblechen während der Schnellkühlung

    Eßl, W., Antretter, T. & Parteder, E., 2015.

    Research output: Contribution to conference › Presentation › Research › peer-review

  3. Published

    Size effects in residual stress formation during quenching of cylinders made of hot-work tool steel

    Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2015, In: Advances in Materials Science and Engineering. 7 p., 678056.

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Stress and Deflection Development During Die Embedding into Printed Circuit Boards

    Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 2015, In: Materials Today: Proceedings. 2, 2, p. 4196-4205 10 p.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    The rock cutting process of road headers - Overview of laboratory tests and numerical simulation

    Pittino, G., Galler, R., Mikl-Resch, M. J., Tichy, R., Ecker, W., Antretter, T., Gimpel, M. & Kargl, H., 2015, Future Development of Rock Mechanics: Proceedings of the ISRM Regional Symposium Eurock 2015 & 64th Geomechanics Colloquium. Schubert, W. & Kluckner, A. (eds.). Salzburg: Eigenverlag, p. 243-248 6 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. 2014
  7. Published

    The role of phase interface energy in martensitic transformation: A lattice Monte-Carlo simulation

    Yastrebov, V. A., Fischlschweiger, M., Cailletaud, G. & Antretter, T., Mar 2014, In: Mechanics Research Communications. 56, p. 37-41

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

    Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Pélisset, T., Karunamurthy, B., Otremba, R. & Antretter, T., 2014.

    Research output: Contribution to conference › Poster › Research › peer-review

  10. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Antretter, T., Otremba, R., Karunamurthy, B. & Pélisset, T., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  11. Published

    Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

    Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330

    Research output: Contribution to journal › Article › Research › peer-review

  12. Published

    Determination of cyclic mechanical properties of thin copper layers for PCB applications

    Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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