Montanuniversität
Organisational unit: University
Research output
- Published
Inline monitoring and control for Automated Tape Laying
Yadav, N., 2023Research output: Thesis › Doctoral Thesis
- E-pub ahead of print
In-line and off-line NDT defect monitoring for thermoplastic automated tape layup
Yadav, N., Oswald-Tranta, B., Gürocak, M., Galic, A., Adam, R. & Schledjewski, R., 31 Mar 2023, (E-pub ahead of print) In: NDT and E international. 137.2023, July, 8 p., 102839.Research output: Contribution to journal › Article › Research › peer-review
- Published
INLINE PROCESS MONITORING AND FAILURE MANAGEMENT CONCEPT FOR ATL
Yadav, N., Schledjewski, R. & Fauster, E., 2024, Proceedings of the 21st European Conference on Composite Materials: Volume 5 - Manufacturing. p. 497-502 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Reservoir Characterisation using Tracers: Analytical versus Numerical Methods
Yahyaoui, G., 2017Research output: Thesis › Master's Thesis
- Published
General Assessment of Industry 4.0 Awareness in South India —A Precondition for Efficient Organization Models?
Yaibuathet Tippayawong, K., Safar, L., Sopko, J., Dancakova, D. & Woschank, M., 1 Jun 2021, Industry 4.0 for SMEs: Concepts, Examples and Applications. Matt, D., Modrak, V. & Zsifkovits, H. (eds.). Cham: Palgrave Macmillan Ltd., p. 345-391Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
- Published
Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions
Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates
Yalagach, M., Fuchs, P., Antretter, T., Feuchter, M., Tao, Q. & Weber, M., 29 Jan 2021, In: Sensors & transducers. 248.2021, 1, 9 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Automatic First Break Detection Using Support Vector Machine Classification
Yalcinoglu, L., Millahn, K. & Fruhwirth, R. K., 2011. 4 p.Research output: Contribution to conference › Paper › peer-review
