Deep Reinforcement Learning for Mapless Navigation of Autonomous Mobile Robot

Yadav, H., Xue, H., Rudall , Y., Bakr, M., Hein, B., Rückert, E. & Nguyen, T., 26 Jun 2023, International Conference on System Theory, Control and Computing (ICSTCC). ( International Conference on System Theory, Control and Computing (ICSTCC)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

INLINE PROCESS MONITORING AND FAILURE MANAGEMENT CONCEPT FOR ATL

Yadav, N., Schledjewski, R. & Fauster, E., 2024, Proceedings of the 21st European Conference on Composite Materials: Volume 5 - Manufacturing. p. 497-502 6 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

General Assessment of Industry 4.0 Awareness in South India —A Precondition for Efficient Organization Models?

Yaibuathet Tippayawong, K., Safar, L., Sopko, J., Dancakova, D. & Woschank, M., 1 Jun 2021, Industry 4.0 for SMEs: Concepts, Examples and Applications. Matt, D., Modrak, V. & Zsifkovits, H. (eds.). Cham: Palgrave Macmillan Ltd., p. 345-391

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research

Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution