Chair of Mechanics (400)
Organisational unit: Chair
Research output
- Published
Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process
Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Stress and Deflection Development During Die Embedding into Printed Circuit Boards
Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 2015, In: Materials Today: Proceedings. 2, 2, p. 4196-4205 10 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Simulation of the packaging process of embedded components in printed circuit boards
Macurova, K., 2015Research output: Thesis › Doctoral Thesis
- Published
Multi-scale modeling of bainitic phase transformation in multi-variant polycrystalline low alloy steels
Mahnken, R., Schneidt, A., Antretter, T., Ehlenbröker, U. & Wolff, M., 2015, In: International journal of solids and structures. 54, p. 156-171Research output: Contribution to journal › Article › Research › peer-review
- Published
Macro Modelling and Homogenization for Transformation Induced Plasticity of a Low-Alloy Steel
Mahnken, R., Schneidt, A. & Antretter, T., 2009, In: International journal of plasticity. 25, p. 183-204Research output: Contribution to journal › Article › Research › peer-review
- Published
Macro Modeling and Homogenization for Identification of Material Parameters to Simulate Phase Transformations
Mahnken, R., Schneidt, A. & Antretter, T., 2008, Macro Modeling and Homogenization for Identification of Material Parameters to Simulate Phase Transformations. Civil-Comp Press, p. 1-13Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Influence of different microstructures of the welding zone on the fatigue crack growth behaviour of HSLA steels
Maier, B., Guster, C., Tichy, R. & Ecker, W., 2013, 13th International Conference on Fracture - Abstract Book. p. 211-211Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
