Journal of Microelectronics and Electronic Packaging, ‎1551-4897

Journal

ISSNs1551-4897
1 - 2 out of 2Page size: 10

Research output

  1. 2016
  2. Published

    Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments

    Bermejo, R., Krautgasser, C., Deluca, M., Pletz, M., Supancic, P., Aldrian, F. & Danzer, R., 2016, In: Journal of Microelectronics and Electronic Packaging. 13, 1, p. 17-22 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  3. 2015
  4. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

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