Publikationen

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2013
Veröffentlicht
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr. 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Veröffentlicht
A new roughness parameter to evaluate the near-surface deformation in dry rolling/sliding contact
Kubin, W. K., Pletz, M., Daves, W. & Scheriau, S., 2013, in: Tribology International. 67, S. 132-139
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
2012
Veröffentlicht
A Wheel Passing a Crossing Nose- Dynamic Analysis under High Axle Loads using Finite Element Modelling
Pletz, M., Daves, W. & Ossberger, H., 10 Okt. 2012, in: Proceedings of the Institution of Mechanical Engineers. Part F, Journal of rail and rapid transit. 226, 6, S. 603-611 9 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
A wheel set/crossing model regarding impact, sliding and deformation-Explicit finite element approach: Wear
Pletz, M., Daves, W. & Ossberger, H., 2012, in: Wear. 294-295, S. 446-456 11 S.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Veröffentlicht
Damage in Railway Crossings - Numerical Models
Pletz, M., 2012
Publikationen: Thesis / Studienabschlussarbeiten und Habilitationsschriften › Dissertation
Veröffentlicht
Influence of deposited metal structures on the failure mechanisms of silicon-based components
Deluca, M., Bermejo Moratinos, R., Pletz, M., Wießner, M., Supancic, P. & Danzer, R., 2012, in: Journal of the European Ceramic Society. 32, S. 4371-4380
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
2011
Veröffentlicht
Local strength measurement technique for miniaturised silicon-based components
Deluca, M., Pletz, M., Morianz, M., Stahr, J., Supancic, P., Danzer, R. & Bermejo, R., 2011, 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 5765812
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Veröffentlicht
Numerical investigation of the process of embedding components into printed circuit boards
Pletz, M., Bermejo, R., Supancic, P., Stahr, J. & Morianz, M., 2011, 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 5765814
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Veröffentlicht
Strength and fracture analysis of silicon-based components for embedding
Deluca, M., Bermejo Moratinos, R., Pletz, M., Supancic, P. & Danzer, R., 2011, in: Journal of the European Ceramic Society. 31, S. 549-558
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
2010
Veröffentlicht
Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards
Bermejo Moratinos, R., Deluca, M., pletz, M., Supancic, P. & Danzer, R., 2010.
Publikationen: Konferenzbeitrag › Poster › Forschung › (peer-reviewed)

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Forschungsportal

Publikationen

Multi-physics simulation of the component attachment within embedding process

A new roughness parameter to evaluate the near-surface deformation in dry rolling/sliding contact

A Wheel Passing a Crossing Nose- Dynamic Analysis under High Axle Loads using Finite Element Modelling

A wheel set/crossing model regarding impact, sliding and deformation-Explicit finite element approach: Wear

Damage in Railway Crossings - Numerical Models

Influence of deposited metal structures on the failure mechanisms of silicon-based components

Local strength measurement technique for miniaturised silicon-based components

Numerical investigation of the process of embedding components into printed circuit boards

Strength and fracture analysis of silicon-based components for embedding

Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards

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