Numerical investigation of the process of embedding components into printed circuit boards
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Autoren
Organisationseinheiten
Externe Organisationseinheiten
- Materials Center Leoben Forschungs GmbH
- AT&S - Austria Technologie & Systemtechnik Aktiengesselschaft Leoben
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 |
| DOIs | |
| Status | Veröffentlicht - 2011 |
| Veranstaltung | 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 - Linz, Österreich Dauer: 18 Apr. 2011 → 20 Apr. 2011 |
Konferenz
| Konferenz | 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 |
|---|---|
| Land/Gebiet | Österreich |
| Ort | Linz |
| Zeitraum | 18/04/11 → 20/04/11 |
