Numerical investigation of the process of embedding components into printed circuit boards
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Materials Center Leoben Forschungs GmbH
- AT and S AG
Details
| Original language | English |
|---|---|
| Title of host publication | 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 |
| DOIs | |
| Publication status | Published - 2011 |
| Event | 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 - Linz, Austria Duration: 18 Apr 2011 → 20 Apr 2011 |
Conference
| Conference | 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 |
|---|---|
| Country/Territory | Austria |
| City | Linz |
| Period | 18/04/11 → 20/04/11 |
