Numerical investigation of the process of embedding components into printed circuit boards

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Standard

Numerical investigation of the process of embedding components into printed circuit boards. / Pletz, Martin; Bermejo, Raul; Supancic, Peter et al.
2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 2011. 5765814.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Harvard

Pletz, M, Bermejo, R, Supancic, P, Stahr, J & Morianz, M 2011, Numerical investigation of the process of embedding components into printed circuit boards. in 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011., 5765814, 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, Linz, Austria, 18/04/11. https://doi.org/10.1109/ESIME.2011.5765814

APA

Pletz, M., Bermejo, R., Supancic, P., Stahr, J., & Morianz, M. (2011). Numerical investigation of the process of embedding components into printed circuit boards. In 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 Article 5765814 https://doi.org/10.1109/ESIME.2011.5765814

Vancouver

Pletz M, Bermejo R, Supancic P, Stahr J, Morianz M. Numerical investigation of the process of embedding components into printed circuit boards. In 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 2011. 5765814 doi: 10.1109/ESIME.2011.5765814

Author

Pletz, Martin ; Bermejo, Raul ; Supancic, Peter et al. / Numerical investigation of the process of embedding components into printed circuit boards. 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. 2011.

Bibtex - Download

@inproceedings{59277f6761e440deb25474834f9e87e2,
title = "Numerical investigation of the process of embedding components into printed circuit boards",
author = "Martin Pletz and Raul Bermejo and Peter Supancic and Johannes Stahr and Mike Morianz",
year = "2011",
doi = "10.1109/ESIME.2011.5765814",
language = "English",
isbn = "9781457701078",
booktitle = "2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011",
note = "2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 ; Conference date: 18-04-2011 Through 20-04-2011",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Numerical investigation of the process of embedding components into printed circuit boards

AU - Pletz, Martin

AU - Bermejo, Raul

AU - Supancic, Peter

AU - Stahr, Johannes

AU - Morianz, Mike

PY - 2011

Y1 - 2011

UR - http://www.scopus.com/inward/record.url?scp=79957885984&partnerID=8YFLogxK

U2 - 10.1109/ESIME.2011.5765814

DO - 10.1109/ESIME.2011.5765814

M3 - Conference contribution

AN - SCOPUS:79957885984

SN - 9781457701078

BT - 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011

T2 - 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011

Y2 - 18 April 2011 through 20 April 2011

ER -

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