Peter Fuchs
(Ehemalig)
1 - 10 von 19Seitengröße: 10
Publikationen
- Veröffentlicht
A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies
Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Comparison and Impact of Different Fiber Debond Techniques on Fiber Reinforced Flexible Composites
Beter, J., Schrittesser, B., Maroh, B., Sarlin, E., Fuchs, P. F. & Pinter, G., 18 Feb. 2020, in: Polymers. 12.2020, 2, 11 S., 472.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics
Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Finite element analysis of arbitrarily complex electronics devices
Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T. & Tao, Q., 2016, Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. S. 497-500Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Gradient polymer composites for optimum heat dissipation
Marx, P., Morak, M., Gschwandl, M., Fuchs, P., Antretter, T., Pfost, M., Kern, W. & Wiesbrock, F., 2018, in: Journal of the American Chemical Society. 2, 1 S., PMSE-772.Publikationen: Beitrag in Fachzeitschrift › Meeting Abstract
- Veröffentlicht
Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov. 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Influence of Fiber Orientation and Adhesion Properties On Tailored Fiber-reinforced Elastomers
Beter, J., Schrittesser, B., Meier, G., Fuchs, P. F. & Pinter, G., 4 Mai 2020, in: Applied composite materials. 27.2020, 3, S. 149-164 16 S.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
