Simulation of stiff systems on real-time hardware

Zaev, E., Babunski, D., Tuneski, A. & Rath, G., 6 Jul 2018, 2018 7th Mediterranean Conference on Embedded Computing, MECO 2018 - Including ECYPS 2018, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-4 4 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Robust machine vision based displacement analysis for tunnel boring machines

Gugg, C. & O'Leary, P., 6 Jul 2015, Conference Record - IEEE Instrumentation and Measurement Technology Conference. Institute of Electrical and Electronics Engineers, Vol. 2015-July. p. 875-880 6 p. 7151384

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Real-time tensor polynomial approximation of crosshatch measured geometric surface data

Harker, M., O'Leary, P., Plessing, L., Hergan, P. & Fauster, E., 10 Jul 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

PermeabilityNets: Comparing Neural Network Architectures on a Sequence-to-Instance Task in CFRP Manufacturing

Stieber, S., Schroter, N., Fauster, E., Schiendorfer, A. & Reif, W., 2021, Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021. Wani, M. A., Sethi, I. K., Shi, W., Qu, G., Raicu, D. S. & Jin, R. (eds.). Institute of Electrical and Electronics Engineers, p. 694-697 4 p. (Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Oscillation Damping With Input Shaping in Individual Metering Hydraulic Systems

Rath, G., Zaev, E. & Babunski, D., 1 Jun 2019, 2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings. Stojanovic, R., Jozwiak, L., Lutovac, B. & Jurisic, D. (eds.). Institute of Electrical and Electronics Engineers, 8760056. (2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical Investigation of Collective Motion of Cathode Spots

Kharicha, A., Karimi-Sibaki, E., Ludwig, A. & Wu, M., 15 Nov 2018, 28th International Symposium on Discharges and Electrical Insulation in Vacuum: ISDEIV. Institute of Electrical and Electronics Engineers, Vol. 2. p. 467-469 3 p. (International Symposium on Discharges and Elevtrical Insultaion in Vacuum, ISDEIV).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution