Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Simulation of stiff systems on real-time hardware

Zaev, E., Babunski, D., Tuneski, A. & Rath, G., 6 Jul 2018, 2018 7th Mediterranean Conference on Embedded Computing, MECO 2018 - Including ECYPS 2018, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-4 4 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hardware-in-the-loop for Simulation and Control of Greenhouse Climate

Zaev, E., Babunski, D., Jovanov, A., Rath, G. & Payr, M. P., 7 Jun 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Budva: Institute of Electrical and Electronics Engineers, 9460206. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Measurement of WBG-based power supplies

Zhu, H., Jafari, A., MacHtinger, K., Makoschitz, M. & Matioli, E., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution