Research output

1 - 10 out of 117Page size: 10
rss feed
Sort by: Title
  1. Published

    33-2: Invited Paper: Evaluating Reliability of Flexible Electronic Materials with Combined Electro-Mechanical Testing Techniques

    Cordill, M., Berger, J. & Jörg, T., 2016, Digest of technical papers / Society for Information Display, SID. (Digest of technical papers / Society for Information Display, SID).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  2. Published

    Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating

    Wurster, S., Bigl, S., Cordill, M. & Kiener, D., 5 Jan 2017, In: Microelectronic engineering. 167.2017, 5 January, p. 110-118 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

  3. E-pub ahead of print

    A correlative experimental and ab initio approach to improve the fracture behavior of Mo thin films by alloying with Cu

    Jörg, T., Music, D., Cordill, M., Franz, R., Köstenbauer, H., Linke, C., Winkler, J., Schneider, J. M. & Mitterer, C., 25 Sept 2017, (E-pub ahead of print) In: Applied physics letters. 111.2017, 13, p. 134101-1-134101-4

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Adhesion Energies of Cr Thin Films on Polyimide Determined from Buckling: Experiment and Model

    Cordill, M., Fischer, F. D., Rammerstorfer, F. G. & Dehm, G., 2010, In: Acta materialia. 58, p. 5520-5531

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    Adhesion measurements of printed circuit boards using four point bending

    Cordill, M., 2013.

    Research output: Contribution to conference › Poster › Research › peer-review

  6. Published

    Adhesion of metal-polymer interfaces

    Cordill, M., 2014

    Research output: Thesis › Habilitation thesis › peer-review

  7. Published

    Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

    Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    Advanced Characterization of thermo-mechanical fatigue mechanisms for semiconductor metallizations

    Bigl, S., Wurster, S., Schöberl, T., Cordill, M. & Kiener, D., 2016.

    Research output: Contribution to conference › Presentation › Research › peer-review

  9. Published

    A Mechanical Method for Preparing TEM Samples from Brittle Films on Compliant Substrates

    Taylor, A. A., Cordill, M., Moser, G. & Dehm, G., 2011, In: Practical metallography = Praktische Metallographie. 48, p. 408-413

    Research output: Contribution to journal › Article › Research › peer-review

  10. E-pub ahead of print

    Annealing effects on the film stress and adhesion of tungsten-titanium barrier layers

    Kleinbichler, A., Todt, J., Zechner, J., Wöhlert, S., Többens, D. & Cordill, M., 18 Sept 2017, (E-pub ahead of print) In: Surface & coatings technology. 332.2017, 25 December, p. 376-381 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

Previous 1 2 3 4 5 6 7 8 ...12 Next

Advanced filters

All authors

Reset

to
Reset filters