Adhesion measurements of printed circuit boards using four point bending
Research output: Contribution to conference › Poster › Research › peer-review
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| Translated title of the contribution | Adhesion measurements of printed circuit boards using four point bending |
|---|---|
| Original language | English |
| Publication status | Published - 2013 |
| Event | EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials - Sevilla, Spain Duration: 8 Sept 2013 → … |
Conference
| Conference | EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials |
|---|---|
| Country/Territory | Spain |
| City | Sevilla |
| Period | 8/09/13 → … |
