Research output

  1. 2014
  2. Published

    MESSUNG VON AKUSTISCHEM RAUSCHEN ZUR STEUERUNG DER HERSTELLUNG EINES BAUTEILS AUS EINEM FLIESSFÄHIGEN GRUNDMATERIAL

    Kukla, C., Lucyshyn, T., Rath, G., Müller, F., Kukla, C., Lucyshyn, T., Rath, G. & Müller, F., 3 Dec 2014, IPC No. G01N 29/ 46 A I, Patent No. EP2807011, Priority date 20 Dec 2012, Priority No. WO2012EP76526

    Research output: Patent

  3. Published

    Acoustic noise sensing for controlling manufacture of a component part made of a flowable base material

    Kukla, C., Lucyshyn, T., Rath, G. & Mueller, F., 12 Nov 2014, IPC No. B29C 45/ 76 A I, Patent No. CN104144778, Priority date 20 Dec 2012, Priority No. WO2012EP76526

    Research output: Patent

  4. Published

    ACOUSTIC NOISE SENSING FOR CONTROLLING MANUFACTURE OF A COMPONENT PART MADE OF A FLOWABLE BASE MATERIAL

    Kukla, C., Lucyshyn, T., Rath, G. & Mueller, F., 8 Oct 2014, IPC No. B29C 45/ 76 A I, Patent No. KR20140119154, Priority date 20 Dec 2012, Priority No. WO2012EP76526

    Research output: Patent

  5. Published

    Interface conditions of two-shot molded parts

    Kisslinger, T., Bruckmoser, K., Lucyshyn, T., Langecker, G., Resch, K. & Holzer, C., 15 May 2014, Proceedings of PPS-29: The 29th International Conference of the Polymer Processing Society - Conference Papers. p. 170-174 (AIP conference proceedings; vol. 1593).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  6. Published

    The role of phase interface energy in martensitic transformation: A lattice Monte-Carlo simulation

    Yastrebov, V. A., Fischlschweiger, M., Cailletaud, G. & Antretter, T., Mar 2014, In: Mechanics Research Communications. 56, p. 37-41

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

    Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published

    Calculation Tool for the Estimation of Injection Mold Deformation Based on FEM-Simulations

    Lucyshyn, T., Kisslinger, T., Langecker, G. & Holzer, C., 2014, Proceedings of PPS2014. p. 1-3

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Pélisset, T., Karunamurthy, B., Otremba, R. & Antretter, T., 2014.

    Research output: Contribution to conferencePosterResearchpeer-review

  10. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Antretter, T., Otremba, R., Karunamurthy, B. & Pélisset, T., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  11. Published

    Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

    Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330

    Research output: Contribution to journalArticleResearchpeer-review