Thomas Antretter
Research output
- Published
Multifunctional Shape Memory Alloys Processed by SPD
Waitz, T., Mangler, C., Steiner, G., Peterlechner, M., Antretter, T., Fischer, F. D. & Pranger, W., 2011, Proceedings of International Symposium on Giant Straining Process for Advanced Materials (GSAM). p. 1-10Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Size Effects on the Martensitic Martensitic Phase Transformation of NiTi Nanograins
Waitz, T., Antretter, T., Fischer, F. D., Simha, N. K. & Karnthaler, H.-P., 2007, In: Journal of the mechanics and physics of solids. 55, p. 419-444Research output: Contribution to journal › Article › Research › peer-review
- Published
Martensitic phase transformations of bulk nanocrystalline NiTi alloys
Waitz, T., Karnthaler, H. P., Antretter, T. & Fischer, F. D., 1 Dec 2005, Proceedings of an International Conference on Solid-Solid Phase Transformations in Inorganic Materials 2005. Howe, J. M., Laughlin, D. E., Lee, J. K., Dahmen, U. & Soffa, W. A. (eds.). Vol. 2. p. 885-898 14 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Multifunctional Shape Memory Alloys processed by SPD
Waitz, T., Mangler, C., Antretter, T., Fischer, F.-D., Pranger, W. & Müllner, P., 2011, Proceedings of International Symposium on Giant Straining Process for Advanced Materials (GSAM). p. 88-94Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Finite Element Simulation of the Effect of surface roughness on nanoindentation of thin films with spherical indenters
Walter, C., Antretter, T., Daniel, R. & Mitterer, C., 2007, In: Surface & coatings technology. 202, p. 1103-1107Research output: Contribution to journal › Article › Research › peer-review
- Published
Deformation-induced phase transformation in a Co-Cr-W-Mo alloy studied by high-energy X-ray diffraction during in-situ compression tests
Weißensteiner, I., Petersmann, M., Erdely, P., Stark, A., Antretter, T., Clemens, H. & Maier-Kiener, V., Feb 2019, In: Acta materialia. 164.2019, February, p. 272-282 11 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
MUL 4.0 – Digitalisierung der Wertschöpfungskette vom Rohmaterial bis hin zum Recycling
Woschank, M., Ralph, B. J., Kaiblinger, A., Miklautsch, P., Pacher, C., Sorger, M., Zsifkovits, H., Stockinger, M., Pogatscher, S., Antretter, T. & Antrekowitsch, H., 2 Jun 2021, In: Berg- und hüttenmännische Monatshefte : BHM. 166, 6, p. 309-313Research output: Contribution to journal › Article › Research › peer-review
- Published
Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions
Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution