Thomas Antretter

Research output

  1. Published

    Model-Based Residual Stress Design in Multiphase Seamless Steel Tubes

    Leitner, S., Winter, G., Klarner, J., Antretter, T. & Ecker, W., 16 Jan 2020, In: Materials. 13.2020, 2, 12 p., 439.

    Research output: Contribution to journalArticleResearchpeer-review

  2. Published

    Analysis of shape, orientation and interface properties of Mo2C precipitates in Fe using ab-initio and finite element method calculations

    Leitner, S., Scheiber, D., Dengg, T., Spitaler, J., Antretter, T. & Ecker, W., 1 Feb 2021, In: Acta materialia. 204.2021, 1 February, 11 p., 116478.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Residual Stress Evolution in Low-Alloyed Steel at Three Different Length Scales

    Leitner, S., Winter, G., Klarner, J., Antretter, T. & Ecker, W., 23 Mar 2023, In: Materials. 16.2023, 7, 17 p., 2568.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Multi-physics simulation of the component attachment within embedding process

    Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  5. Published

    Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

    Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  6. Published

    Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

    Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. Published

    Stress and Deflection Development During Die Embedding into Printed Circuit Boards

    Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 2015, In: Materials Today: Proceedings. 2, 2, p. 4196-4205 10 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published

    Multi-scale modeling of bainitic phase transformation in multi-variant polycrystalline low alloy steels

    Mahnken, R., Schneidt, A., Antretter, T., Ehlenbröker, U. & Wolff, M., 2015, In: International journal of solids and structures. 54, p. 156-171

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Macro Modelling and Homogenization for Transformation Induced Plasticity of a Low-Alloy Steel

    Mahnken, R., Schneidt, A. & Antretter, T., 2009, In: International journal of plasticity. 25, p. 183-204

    Research output: Contribution to journalArticleResearchpeer-review

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