Ruth Konetschnik
(Former)
1 - 10 out of 33Page size: 10
Research output
- Published
Novel methods for the site specific preparation of micromechanical structures
Wurster, S., Treml, R., Fritz, R., Kapp, M. W., Langs, E., Alfreider, M., Ruhs, C., Imrich, P. J., Felber, G. & Kiener, D., 2014, Fortschritte in der Metallographie. p. 27-36Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Novel methods for the site specific preparation of micromechanical structures
Wurster, S., Treml, R., Fritz, R., Kapp, M. W., Langs, E., Alfreider, M., Ruhs, C., Imrich, P. J., Felber, G. & Kiener, D., 2015, In: Practical metallography = Praktische Metallographie. 52, 3, p. 131-146 16 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Experimental and Numerical Investigation of the Deformation and Fracture Mode of Microcantilever Beams Made of Cr(Re)/Al2O3 Metal-Matrix Composite
Weglewski, W., Pitchai, P., Bochenek, K., Bolzon, G., Konetschnik, R., Sartory, B., Ebner, R., Kiener, D. & Basista, M., May 2020, In: Metallurgical and materials transactions. A, Physical metallurgy and materials science . 51.2020, May, p. 2377-2390 14 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
High resolution determination of local residual stress gradients in single- and multilayer thin film systems
Treml, R., Kozic, D., Zechner, J., Maeder, X., Gänser, H.-P., Schöngrundner, R., Michler, J., Brunner, R. & Kiener, D., 2016, In: Acta materialia. 103, p. 616-623Research output: Contribution to journal › Article › Research › peer-review
- Published
Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method
Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330Research output: Contribution to journal › Article › Research › peer-review
- Published
Deformation Mechanisms in Magnetron Sputtered Thin Film Metallic Glasses
Mühlbacher, M., Gammer, C., Konetschnik, R., Schöberl, T., Mitterer, C. & Eckert, J., Mar 2017.Research output: Contribution to conference › Poster › Research
- Published
Residual Stress Investigations in Thin Film Systems: Experiment and Simulation
Kozic, D., Treml, R., Sartory, B., Schöngrundner, R., Kiener, D., Antretter, T., Gänser, H.-P. & Brunner, R., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method
Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Fracture mechanics of thin film systems on the sub-micron scale
Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Fracture and Material Behavior of Thin Film composites
Kozic, D., Konetschnik, R., Maier-Kiener, V., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, p. 1-6 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
