Fracture mechanics of thin film systems on the sub-micron scale
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Materials Center Leoben Forschungs GmbH
- Eidgenössische Materialprüfanstalt, EMPA
Details
| Original language | English |
|---|---|
| Title of host publication | 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 |
| Publisher | Institute of Electrical and Electronics Engineers |
| ISBN (print) | 9781479999507 |
| DOIs | |
| Publication status | Published - 6 May 2015 |
| Event | 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 - Budapest, Hungary Duration: 19 Apr 2015 → 22 Apr 2015 |
Conference
| Conference | 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 |
|---|---|
| Abbreviated title | EuroSimE 2015 |
| Country/Territory | Hungary |
| City | Budapest |
| Period | 19/04/15 → 22/04/15 |
