Fracture and Material Behavior of Thin Film composites

Research output: Chapter in Book/Report/Conference proceedingConference contribution

External Organisational units

  • Materials Center Leoben Forschungs GmbH
  • Voestalpine Tubulars

Details

Original languageEnglish
Title of host publication2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
PublisherInstitute of Electrical and Electronics Engineers
Pages1-6
Number of pages6
ISBN (electronic)978-1-5090-2106-2/16/$31.00
DOIs
Publication statusPublished - 2016
Event17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Montpellier, France
Duration: 17 Apr 201620 Apr 2016

Conference

Conference17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Country/TerritoryFrance
CityMontpellier
Period17/04/1620/04/16