Ruth Konetschnik
(Former)
21 - 30 out of 33Page size: 10
Research output
- Published
Lokale Verformungsanalyse an einkristallinen Cu- und Au-Mikrozugproben mit Hilfe von Bildkorrelationsverfahren und AFM-Messungen
Konetschnik, R., 2012Research output: Thesis › Diploma Thesis
- Published
Residual Stresses and Crack Growth in Microelectronic Thin Films
Konetschnik, R., 2017Research output: Thesis › Doctoral Thesis
- Published
Residual Stress Investigations in Thin Film Systems: Experiment and Simulation
Kozic, D., Treml, R., Sartory, B., Schöngrundner, R., Kiener, D., Antretter, T., Gänser, H.-P. & Brunner, R., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method
Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Fracture mechanics of thin film systems on the sub-micron scale
Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Fracture and Material Behavior of Thin Film composites
Kozic, D., Konetschnik, R., Maier-Kiener, V., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, p. 1-6 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- E-pub ahead of print
Extracting flow curves from nano-sized metal layers in thin film systems
Kozic, D., Maier-Kiener, V., Konetschnik, R., Gänser, H.-P., Antretter, T., Brunner, R. & Kiener, D., 7 Dec 2016, (E-pub ahead of print) In: Scripta materialia. 130.2017, 15 March, p. 143-147 5 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Deformation Mechanisms in Magnetron Sputtered Thin Film Metallic Glasses
Mühlbacher, M., Gammer, C., Konetschnik, R., Schöberl, T., Mitterer, C. & Eckert, J., Mar 2017.Research output: Contribution to conference › Poster › Research
- Published
Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method
Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330Research output: Contribution to journal › Article › Research › peer-review
- Published
High resolution determination of local residual stress gradients in single- and multilayer thin film systems
Treml, R., Kozic, D., Zechner, J., Maeder, X., Gänser, H.-P., Schöngrundner, R., Michler, J., Brunner, R. & Kiener, D., 2016, In: Acta materialia. 103, p. 616-623Research output: Contribution to journal › Article › Research › peer-review
