Raul Bermejo
61 - 70 out of 219Page size: 10
Research output
- Published
Numerical Analysis of Sub-Critical Crack Growth in Particulate Ceramic Composites
Majer, Z., Pletz, M., Krautgasser, C., Nalik, L., Hutar, P. & Bermejo Moratinos, R., 2014, In: Procedia Materials Science. 3, p. 2071-2076Research output: Contribution to journal › Article › Research › peer-review
- Published
Residual lifetime determination of low temperature co-fired ceramics
Majer, Z., Štegnerová, K., Hutar, P., Pletz, M., Bermejo, R. & Náhlík, L., 2016, Advances in Fracture and Damage Mechanics XV. Trans Tech Publications, Vol. 713. p. 266-269 4 p. (Key Engineering Materials; vol. 713).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Study of Influence of Residual Stresses on Crack Propagation in Particulate Ceramic Composites
Majer, Z., Štegnerová, K., Hutar, P., Pletz, M., Bermejo, R. & Náhlík, L., 2017, Solid State Phenomena . Vol. 258. p. 178-181 4 p. (Solid State Phenomena).Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
- Published
Position resolved residual stress determination in alumina-zirconia multilayered ceramics
Maier, G., Keckes, J., Brechbuehl, J., Guerault, H. & Bermejo Moratinos, R., 2008, In: Materials Science Forum . 571-572, p. 421-425Research output: Contribution to journal › Article › Research › peer-review
- Published
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process
Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Stress and Deflection Development During Die Embedding into Printed Circuit Boards
Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 2015, In: Materials Today: Proceedings. 2, 2, p. 4196-4205 10 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Mechanical testing and fracture analyses of miniaturized ZnO-based multilayer components
Macurova, K., Gruber, M., Pletz, M., Supancic, P., Danzer, R., Aldrian, F. & Bermejo, R., 26 Oct 2015Research output: Other contribution › Research
- Published
Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.Research output: Contribution to journal › Article › Research › peer-review
