Megan Cordill
(Former)
Research output
- 2017
- Published
Influence of extreme thermal cycling on metal-polymer interfaces
Putz, B., Völker, B., Semprimoschnig, C. & Cordill, M. J., 5 Jan 2017, In: Microelectronic engineering. 167.2017, 5 January, p. 17-22 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
The driving force governing room temperature grain coarsening in thin gold films
Glushko, O. & Cordill, M., 2017, In: Scripta Materialia. 130.2017, 15 March, p. 42-45 4 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Thin Film Adhesion of Flexible Electronics Influenced by Interlayers
Kleinbichler, A., Bartosik, M., Völker, B. & Cordill, M., 2017, In: Advanced engineering materials. 19.2017, 4, 7 p., 1600665.Research output: Contribution to journal › Article › Research › peer-review
- 2016
- Published
Correlative microstructure and topography informed nanoindentation of copper films
Bigl, S., Schöberl, T., Wurster, S., Cordill, M. & Kiener, D., 25 Dec 2016, In: Surface & coatings technology. 308.2016, 25 December, p. 404-413 10 p.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
Kleinbichler, A., Zechner, J. & Cordill, M., 2 Nov 2016, (E-pub ahead of print) In: Microelectronic engineering. 167.2017, 5 January, p. 63-68 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Grain growth during cyclic straining of copper film revealed with in-situ resistance measurements
Cordill, M. & Glushko, O., 25 Oct 2016.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Evaluating reliability of flexible electronic materials with combined electromechanical testing techniques
Cordill, M., 25 May 2016.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
Examining nanoindentation imprints with in-situ AFM-SEM
Cordill, M., Kreith, J., Strunz, T. & Fantner, E. J., 30 Mar 2016.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis
Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 22 Mar 2016.Research output: Contribution to conference › Presentation › Research
