Megan Cordill
(Former)
Research output
- Published
33-2: Invited Paper: Evaluating Reliability of Flexible Electronic Materials with Combined Electro-Mechanical Testing Techniques
Cordill, M., Berger, J. & Jörg, T., 2016, Digest of technical papers / Society for Information Display, SID. (Digest of technical papers / Society for Information Display, SID).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating
Wurster, S., Bigl, S., Cordill, M. & Kiener, D., 5 Jan 2017, In: Microelectronic engineering. 167.2017, 5 January, p. 110-118 9 p.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
A correlative experimental and ab initio approach to improve the fracture behavior of Mo thin films by alloying with Cu
Jörg, T., Music, D., Cordill, M., Franz, R., Köstenbauer, H., Linke, C., Winkler, J., Schneider, J. M. & Mitterer, C., 25 Sept 2017, (E-pub ahead of print) In: Applied physics letters. 111.2017, 13, p. 134101-1-134101-4Research output: Contribution to journal › Article › Research › peer-review
- Published
Adhesion Energies of Cr Thin Films on Polyimide Determined from Buckling: Experiment and Model
Cordill, M., Fischer, F. D., Rammerstorfer, F. G. & Dehm, G., 2010, In: Acta materialia. 58, p. 5520-5531Research output: Contribution to journal › Article › Research › peer-review
- Published
Adhesion measurements of printed circuit boards using four point bending
Cordill, M., 2013.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Adhesion of metal-polymer interfaces
Cordill, M., 2014Research output: Thesis › Habilitation thesis › peer-review
- Published
Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Advanced Characterization of thermo-mechanical fatigue mechanisms for semiconductor metallizations
Bigl, S., Wurster, S., Schöberl, T., Cordill, M. & Kiener, D., 2016.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
A Mechanical Method for Preparing TEM Samples from Brittle Films on Compliant Substrates
Taylor, A. A., Cordill, M., Moser, G. & Dehm, G., 2011, In: Practical metallography = Praktische Metallographie. 48, p. 408-413Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Annealing effects on the film stress and adhesion of tungsten-titanium barrier layers
Kleinbichler, A., Todt, J., Zechner, J., Wöhlert, S., Többens, D. & Cordill, M., 18 Sept 2017, (E-pub ahead of print) In: Surface & coatings technology. 332.2017, 25 December, p. 376-381 6 p.Research output: Contribution to journal › Article › Research › peer-review
