Jakub Zalesak
(Former)
Research output
- Published
Probing the composition dependence of residual stress distribution in tungsten-titanium nanocrystalline thin films
Sinojiya, R. J., Paulachan, P., Falah Chamasemani, F., Bodlos, R., Hammer, R., Zalesak, J., Reisinger, M., Scheiber, D., Keckes, J., Romaner, L. & Brunner, R., 15 Feb 2023, In: Communications materials. 2023, 4, 12 p., 11.Research output: Contribution to journal › Article › Research › peer-review
- Published
Ab initio studies on the adsorption and adhesive transfer of Al and Fe to nitride coatings materials
Riedl, H., Zalesak, J., Sobiech, M., Polcik, P., Holec, D. & Mayrhofer, P. H., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Ab initio studies on the adsorption and implantation of Al and Fe to nitride materials
Riedl, H., Zalesak, J., Arndt, M., Polcik, P., Holec, D. & Mayrhofer, P. H., 25 Sept 2015, In: Journal of applied physics. 118.2015, 12, p. 125306 8 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Cross-sectional stress distribution in AlxGa1-xN heterostructure on Si(111) substrate characterized by ion beam layer removal method and precession electron diffraction
Reisinger, M., Zalesak, J., Daniel, R., Tomberger, M., Weiss, J. K., Darbal, A. D., Petrenec, M., Zechner, J., Daumiller, I., Ecker, W., Sartory, B. & Keckes, J., 2016, In: Materials and Design. 106, p. 476-481 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Biomimetic hard and tough nanoceramic Ti–Al–N film with self-assembled six-level hierarchy
Meindlhumer, M., Zalesak, J., Pitonak, R., Todt, J., Sartory, B., Burghammer, M., Stark, A., Schell, N., Daniel, R., Keckes, J., Lessiak, M., Köpf, A., Weißenbacher, R. & Keckes, J., 28 Apr 2019, In: Nanoscale. 11.2019, 16, p. 7986-7995 10 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
Lassnig, A., Terziyska, V. L., Zalesak, J., Jörg, T., Toebbens, D. M., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M. J., 28 Dec 2020, In: ACS Applied Nano Materials. 4.2021, 1, p. 61-70 10 p.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Impact of hydrogen-assisted heat treatments on microstructure and transformation path in a Ni-rich NiTi shape memory alloy
Kuběnová, M., Zálešák, J., Čermák, J. & Dlouhý, A., 13 Aug 2012, (E-pub ahead of print) In: Journal of alloys and compounds. 577.2013, Supplement 1, p. S287-S290 4 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
How Residual Stresses Affect the Fracture Properties of Layered Thin Films
Kiener, D., Treml, R., Kozic, D., Zalesak, J., Zechner, J., Keckes, J., Schöngrundner, R., Gänser, H.-P. & Brunner, R., 2015.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
30 nm X-ray focusing correlates oscillatory stress, texture and structural defect gradients across multilayered Ti N-SiOx thin film
Keckes, J., Daniel, R., Todt, J., Zalesak, J., Sartory, B., Braun, S., Gluch, J., Rosenthal, M., Burghammer, M. C., Mitterer, C., Niese, S. & Kubec, A., 2018, In: Acta materialia. 144, p. 862-873Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
X-ray nanodiffraction analysis of residual stresses in polysilicon electrodes of vertical power transistors
Karner, S., Blank, O., Rösch, M., Burghammer, M., Zalesak, J., Keckes, J. & Todt, J., 20 Jun 2022, (E-pub ahead of print) In: Materialia. 24.2022, August, 6 p., 101484.Research output: Contribution to journal › Article › Research › peer-review
