Backside metallization affects residual stress and bending strength of the recast layer in laser-diced Si

Research output: Contribution to journal › Article › Research › peer-review

Authors

KAI - Kompetenzzentrum Automobil- und Industrieelektronik GmbH
Infineon Technologies AG Austria
ESRF
SMBS - University of Salzburg Business School, Sigmund-Haffner-Gasse 18, A-5020 Salzburg, Austria

Original language	English
Article number	108579
Journal	Materials Science in Semiconductor Processing
Volume	181
DOIs	https://doi.org/10.1016/j.mssp.2024.108579
Publication status	Published - Oct 2024