Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- Erich Schmid Institute of Materials Science
- Helmholtz-Zentrum Berlin für Materialien und Energie (HZB)
Details
| Original language | English |
|---|---|
| Pages (from-to) | 61-70 |
| Number of pages | 10 |
| Journal | ACS Applied Nano Materials |
| Volume | 4.2021 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 28 Dec 2020 |
