Chair of Mechanics (400)
Organisational unit: Chair
711 - 720 out of 809Page size: 10
Research output
- Published
Stress–strain analysis of the antiplane shear problem for an infinite cylindrical inclusion with eigenstrain: an addendum to Arch. Appl. Mech. 2018
Fischer, F.-D., Zickler, G. A. & Svoboda, J., 2 Apr 2018, In: Archive of applied mechanics. 88.2018, 7, p. 1209-1211 3 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Tissue growth controlled by geometric boundary conditions: A simple model recapitulating aspects of callus formation and bone healing
Fischer, F.-D., Zickler, G., Dunlop, J. W. C. & Fratzl, P., 6 Jun 2015, In: Journal of the Royal Society Interface. 12.2015, 107, 8 p., 20150108.Research output: Contribution to journal › Article › Research › peer-review
- Published
A note concerning some aspects for application of a thermodynamic extremal principle (TEP) for continua
Fischer, F.-D., Zickler, G., Hackl, K. & Svoboda, J., 9 Mar 2024, In: Acta mechanica. 235.2024, 5, p. 3309-3312 4 p.Research output: Contribution to journal › Comment/debate › peer-review
- Published
Semiconductor Properties of Thin and Thick Film Ga2O3 Ceramic Layers
Feltz, A. & Gamsjäger, E., 1998, In: Journal of the European Ceramic Society. 18, p. 2217-2226Research output: Contribution to journal › Article › Research › peer-review
- Published
Method development for the cyclic characterization of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Pinter, G., Antretter, T. & Krivec, T., 2014, In: Circuit World. 40, p. 53-60Research output: Contribution to journal › Article › Research › peer-review
- Published
Determination of cyclic mechanical properties of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Degradation of the electrical performance of Printed Circuit Boards (PCBs) after cyclic thermo-mechanical loading
Fellner, K., 2015Research output: Thesis › Doctoral Thesis
- Published
Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads
Fellner, K., Antretter, T., Fuchs, P. F. & Tao, Q., 2016, In: Microelectronics Reliability. p. 148-155Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Cyclic mechanical behavior of thin layers of copper: A theoretical and numerical study
Fellner, K., Antretter, T., Fuchs, P. & Pelisset, T. M. A., 8 Dec 2015, (E-pub ahead of print) In: The Journal of Strain Analysis for Engineering Design. 51.2016, 2, p. 1-9 9 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Modelling of the post-treatment of coating/substrate architectures
Faksa, L., 2019Research output: Thesis › Doctoral Thesis
