Chair of Mechanics (400)
Organisational unit: Chair
Research output
- Published
Measurment of All Six Components of X-Ray Elastic Factors
Ortner, B., Antretter, T., Hofmann, M. & Werner, E., 2008, In: Materials Science Forum . 571-572, p. 225-229Research output: Contribution to journal › Article › Research › peer-review
- Published
Parametrization of a numerical model for rolling contact calculations
Otipka, D., 2024Research output: Thesis › Master's Thesis
- Published
Versagen von feuerverzinkten Stahlbauteilen - Gefüge und Versagen von Werkstoffen
Panzenböck, M., Mendez Martin, F., Rashkova, B., Schütz, P., Kaiser, R., Spiradek-Hahn, K. & Brabetz, M., 2015.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
Versagen von feuerverzinkten Stahlbauteilen
Panzenböck, M., Mendez Martin, F., Rashkova, B., Schütz, P. & Kaiser, R., 2015, Sonderbänder der praktischen Metallographie 47. p. 203-208Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Failure of Hot-Dip Galvanized Steel Parts : Versagen von feuerverzinkten Stahlbauteilen
Panzenböck, M., Mendez Martin, F., Rashkova, B., Schütz, P. & Kaiser, R., Oct 2016, In: Practical metallography = Praktische Metallographie. 53.2016, 10, p. 641-651 11 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Weight Function, J-Integral and Material Forces Approach to Apparent Toughness of Ceramic Multilayers
Pascual-Herrero, J., Chen, C. R., Kolednik, O., Fischer, F., Danzer, R. & Lube, T., 2006, Fracture of Nano and Engineering Materials and Structures: Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006 . Dordrecht: Springer, p. 317-318Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Degradation analysis of thin die-attach layer under cyclic thermal load in microelectronics packaging
Pelisset, T. M. A., 2015Research output: Thesis › Doctoral Thesis
- Published
Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Pélisset, T., Karunamurthy, B., Otremba, R. & Antretter, T., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics
Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
